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vceg1104ls - tr product features plcc - 2 type , outer dimension 3.5 x 2.8 x 1.9mm( l x w x h ) standard product reference sheet features package recommended applications page : 1 ? automotive interior: switch and buttons , meter panel, car audio , hvac, etc. ? wide range t emperature applicable product ? high reliability (for automotive applications and other high - reliability required applications) ? lead C free soldering compatible ? rohs compliant 2016.3.17
vceg 1104 ls - tr unit mm outline dimensions unit mm weight 33mg tolerance 0.2 recommended soldering pad marking for traceability is blackish. page : 2 2016.3.17 no. part name remarks qty. led die ingan 1 lamp housing white resin 1 terminal au/pd plating 2 encapsulant silcorne resin 1
vceg 1104 ls - tr notes3 rth (j - a ) measurement condition substrate:fr - 4 ( t=1.6mm ) pattern size : 16mm 2 specifications page : 3 2016.3.17 note 1 note 2 i f derate linearly from "85 " thermal characteristics thermal resistance junction - ambient r th(j-a) thermal resistance junction - solder point r th(j-s) junction temperature tj 120 150 300 typ. esd testing method : eiaj4701/300(304) human body model(hbm) 1.5k,100pf units (ta=25 ) please refer to page 8, soldering conditions. symbol item i frm 100 t opr reverse voltage v r 5 i f 20 ma i frm 2.86 ma/ 78 repetitive peak forward current "1ms,1/10duty" (ta=25 ) water clear ingan green product overview resin color( emitting area) power dissipation p d i frm derate linearly from "85 " die material emitting color - 40 +100 notes1 white forward current v t sld i f 0.57 ma/ absolute maximum ratings 260 ma operating temperature soldering temperature "reflow soldering" electrostatic discharge threshold "hbm" 1,000 v - 40 +120 resin color(lamp housing) item symbol maximum ratings units mw esd storage temperature t stg notes2 /w notes3 /w
vceg 1104 ls - tr specifications page : 4 2016.3.17 lm luminous flux v i f = 10ma - 0.65 - 525 tolerance 0.1v notes4 notes5 notes7 notes6 dominant wavelength nm d i f = 10ma 515 peak wavelength 535 notes 5,6 please refer to following each sorting chart. 115 ? spectral line half width ?x - p mcd nm i r i f = 10ma i v - 519 v r = 5v - forward voltage min. typ. 2.7 electro and optical characteristics symbol reverse current luminous intensity v f 3.6 (ta=25 ) i f = 10ma units conditions v nm max. 3.2 item a 40 - 115 - - 82 i f = 10ma - - 10 - 390 250 i f = 10ma notes 4 notes7 viewing angle at 50% iv, ?x ; housing long side axis, ?y ; housing short side axis ?y half intensity angle i f = 10ma deg. - 330 390 ta=25 i f =10ma above the table of luminous intensity (iv) values and dominant wavelength (d) values are the setup value of the selection machine tolerance iv 10% d 1nm led's shall be sorted out into the following ranks of luminous intensity and dominant wavelength. d (nm) max. min. i v (mcd) c2 120 150 b 520 525 c3 150 180 c4 180 220 conditions 270 330 530 535 ta=25 i f =10ma c5 220 270 conditions c6 c7 sorting chart for luminous intensity and dominant wavelength 515 520 100 82 100 bz c1 120 luminous intensity (iv) rank dominant wavelength (d) rank min. max. a rank rank c 525 530 d
vceg 1104 ls - tr 0 50 100 -10 0 -50 0 50 100 100 50 0 50 100 - 30 - 60 - 90 60 30 0 90 0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780 relative intensity vs. wavelength conditions: ta = 25 , i f =10ma wavelength (nm) relative intensity technical data spatial distribution conditions: ta = 25 , i f =10ma x direction y direction x y page : 5 relative radiant intensity : (%) 2016.3.17
vceg1104ls - tr 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 0 5 10 15 20 ci 2.4 2.9 3.4 3.9 -40 -20 0 20 40 60 80 100 i f = 10 ma i f = 20 ma i f = 5ma i f = 2ma 1 10 100 2.4 2.9 3.4 3.9 85 25 60 - 20 0 - 40 100 ambient temp. vs. forward voltage condition : i f = 2ma 2 0ma ambient temperature : ta ( ) forward voltage vs. forward current condition : ta = - 40 100 forward voltage v f ( v) forward current i f (ma) forward current vs. relative intensity condition : ta = 25 forward current i f ( ma) relative intensity ambient temp. vs. relative intensity condition : i f = 10 ma ambient temperature : ta ( ) relative intensity technical data forward voltage v f (v) page : 6 2016.3.17
vceg1104ls - tr 1 10 100 1 10 100 0 20 40 60 80 100 120 -20 0 20 40 60 80 100 120 dc duty 50 % duty 20 % duty 10% 515 520 525 530 535 -40 -20 0 20 40 60 80 100 515 520 525 530 535 0 10 20 forward current vs. dominant wavelength condition : ta = 25 forward current i f ( ma ) ambient temp. vs. maximum forward current repeatition frequency f R 1 0hz ambient temperature : ta ( ) dominant wavelength : d (nm) ambient temp. vs. dominant wavelength condition : i f = 1 0ma ambient temperature : ta ( ) maximum forward current vs. duty cycle duty ratio (%) forward current : i frm max. (ma) dominant wavelength : d (nm) technical data max forward current i f max. (ma) page : 7 2016.3.17
vceg1104ls - tr soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density. please do not repeat the heating process in reflow process more than twice. notes 1 recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . notes 2 the reflow soldering process should be done up to twice( 2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution ( acc.to eiaj - 4701/300 ) page : 8 2016.3.17 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90~ 120sec max. pre - heating (soldering 230 max. peak temperature
vceg1104ls - tr page : 9 soldering condition 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touch the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. also, please avoid applying any type of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended . the curing condition, temperature:150 max./time:120sec.max. 7. flow soldering (dip soldering) is not recommended for this product . 8. lsopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. please review the reference chart below for cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. recommended manual soldering condition temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time chemical adaptability isopropyl alcohol trichloroethylene chlorothene acetone thinner page : 9 2016.3.17
vceg1104ls - tr this kind of led lamp is highly sensitive to surge voltage generated by the on/off status change and discharges of static electricity through frictions with synthetic materials, which may cause severe damage to the die or undermine its reliability. damaged products may experience conditions such as extremely high reverse voltage, or a decrease of forward rise voltage, deteriorating its optical characteristic. stanley products are designed to withstand up to 1,000v under the eiaj ed - 4701/300 test ? 304 (hbm), and are packed with anti - static components. however, the following precautions and measures are vital in ensuring product quality during shipment. eiaj ed - 4701/300 304/hbm electrification model: c=100pf, r2=1.5k do not place electrified non - conductive materials near the led product. avoid led products from coming into contact with metallic materials.( should the metallic material be electrified , the sudden surge voltage will most likely damage the product .) avoid a working process which may cause the led product to rub against other materials . install ground wires for any equipment, where they can be installed, with measures to avoid static electricity surges . prepare a esd protective area by placing a conductive mattress ( 1 m max.) and ionizer to remove any static electricity. operators should wear a protective wrist - strap. operators should wear conductive work - clothes and shoes. to handle the products directly, stanley recommends the use of ceramic, and not metallic, tweezers. 2. working environment a dry environment is more likely to cause static electricity. although a dry environment is ideal for storage state of led products, stanley recommends an environment with approximately 50% humidity after the soldering process. recommended static electricity level in the working environment is 150v, which is the same value as integrated circuits (which are sensitive to static electricity). for electric static discharge ( esd) 1. electrification/static electricity protection stanley recommends the following precautions in order to avoid product (die) damage from static electricity , when an operator and other materials electrified by friction coming in contact with the product. page : 10 handling precaution 2016.3.17
vceg 1104 ls - tr page : 11 handling precaution other precautions 1. stanley led lamps have semiconductor characteristics and are designed to ensure high reliability. however, the performance may vary depending on usage conditions 2. absolute maximum ratings are set to prevent led lamps from failing due to excess stress ( temperature , current, voltage, etc .). usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously . 3. in order to ensure high reliability from led lamps, variable factors that arise in actual usage conditions should be taken into account for designing. ( derating of typ., max forward voltage, etc.) 4. please insert protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current . 5. please avoid the stick of foreign material because molding resin in the products have adhesiveness. also please don't touch lens portion. 6. please check the actual performance in the assembly because the specification sheets are described for led device only. 7. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 8. the products are designed to operate without failure in recommended usage conditions. however, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise . 9. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 10. when there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding). please make sure there is no problem before using . 11. the formal specification sheets shall be valid only by exchange of documents signed by both parties. page : 11 2016.3.17
vceg 1104 ls - tr pick up point (lamp housing portion) non allowed pick up area (lens portion) 1. picking up point with nozzle: lamp housing of the product ( area) ( shown below) recommendation the picking up point should be within lamp housing portion, because the silicone resin used for the lens is soft. (if the nozzle makes contact with the lens, the products might be destroyed) handling precaution handling precautions for product mounting please adjust the load, the pick up point, the nozzle diameter, etc. before mounting because the over load can cause the breakage of the lamp housing. a b 2. recommended nozzle shape nozzle with chamfering is recommended load : less than 10n (to avoid the product breaking) page : 12 2016.3.17
vceg 1104 ls - tr packaging specifications this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering as is maximum 672h . if the device needs to be soldered twice, both soldering operations must be completed within 672h. if any components should remain unused, please reseal the package and store them under the conditions described in the recommended storage condition above . this product must be required to perform baking process (moisture removal) for at 48h ( min .) to 72h(max .) at 60 5 degrees celsius if following conditions apply. 1. in the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2 . in the case of time passes for 4weeks(672h) after the package is opened once . baking process should be performed after led having been taken out of the package . baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. time elapsed after package opening in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 70% page : 13 2016.3.17
vceg 1104 ls - tr moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting page : 14 packaging specifications 2016.3.17 no. part name matelrial remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
vceg1104ls - tr packing box ( rohs ? elv compliant) the above measures are all the reference values. the box is selected out of the above table by shipping quantity. b type a material / box cardboard c5bf type b,c material / box cardboard k 5 af partition cardboard k 5 af box type outline dimension l w h (mm) capacity of the box type a 280 265 45 (mm) 3 reels type b 310 235 265 (mm) 15 reels type c 440 310 265 (mm) 30 reels page : 15 packaging specifications 2016.3.17 no. part name matelrial remarks packing box corrugated cardboard without esd protection
vceg1104ls - tr label specification ( acc.to jis - x0503(code - 39 ) product label a. parts number b . bar - code for parts number c. parts code (in - house identification code for each parts number) d. packed parts quantity e . bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details ) g. bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number < remarks> bar - code font : acc.to code - 39(jix0503) b a page : 16 packaging specifications 2016.3.17
vceg 1104 ls - tr taping and reel specifications (acc.to jis - c0806 - 03 appearance note " - tr" means cathode s ide of leds should be placed on the sprocket - hole side. items specifications remarks leader area cover - tape cover - tape shall be longer than 320mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 20 pieces. please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 15 pieces. the end of taping shall be inserted into a slit of the hub. direction to take out page : 17 2016.3.17
vceg 1104 ls - tr taping and reel specifications ( acc.to jis - c0806 - 03 qty . per reel mechanical strength others 2 , 000parts/reel minimum qty. per reel might be 500 parts when getting less than 2,000 parts . in such case, parts of 500 - unit - qty. shall be packed in a reel and the qty . shall be identified on the label. cover - tape adhesive strength shall be 0.1 1.0 n ( an angle between carrier - tape and cover - tape shall be 170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15 mm. qty./reel max. qty. of empty pocket remark 500 1 - 1,000 1 - 1,500 1 - 2,000 2 no continuance reversed - orientation, up - side down placing, side placing and out of spec. parts mixing shall not be held. max. qty. of empty pocket per reel shall be defined as follows. page : 18 2016.3.17
vceg1104ls - tr taping dimensions reel dimensions taping and reel specifications ( acc.to jis - c0806 - 03 unit mm page : 19 2016.3.17 carrier-tape with esd protection cover-tape with esd protection with esd protection carrier-reel no. part name remarks
vceg1104ls - tr lot number notational system - 1 digit production location (mark identify alphabet) - 1 digit production year (last digit of production year 2009 9 , 2010 0 , 2011 1 , ??? ) - 2 digits production month (jan. to sep. , should be 01 , 02 , 03 , ????? ) - 2 digits production date - 3 digits serial number - 2 digits tape and reel following number - 2 digits luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) - 2 digits chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1 digit option rank ( stanley normally print " - " to indicate) page : 20 2016.3.17
vceg1104ls - tr correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following ( 1 ) ( 6 ). ? elv instruction . refer to following ( 1 ) ( 4 ). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 21 2016.3.17
vceg1104ls - tr reliability testing result test item refrerence standard test condition failure room temperature operating life eiaj ed - 4701 /100(101) ta=25 i f =20ma 1,000h 0 / 20 high temperature operating life eiaj ed - 4701 /100(101) ta=85 i f =20ma 1,000h 0 / 20 low temperature operating life eiaj ed - 4701/100(101) ta= - 40 i f =20ma 1,000h 0 / 20 wet high temperature operating life eiaj ed - 4701/100(102) ta=60 90% i f =20ma 1,000h 0 / 20 high temperature storage life eiaj ed - 4701/200(201) ta=120 1,000h 0 / 20 low temperature storage life eiaj ed - 4701/200(202) ta= - 40 1,000h 0 / 20 wet high temperature storage life eiaj ed - 4701/100(101) ta=60 rh=90% 1,000h 0 / 20 thermal shock eiaj ed - 4701/100(105) ta= - 40 120 (each 15min) 1,000cycles 0 / 20 thermal shock operating eiaj ed - 4701/100(105) ta= - 40 (off) 85 ( i f =20ma on) (each 15min) 1,000cycles 0 / 20 cycled temperature humidity operating life eiaj ed - 4701/200(203) ta= - 30 80 95(2h) 8h/cycle i f =20ma 5min on - off 30 cycles 0 / 20 resistance to reflow soldering eiaj ed - 4701/300(301) moisture soak 30 70% 4weeks 672h / preheating 150 180 90 - 120sec max. / soldering 260 peak 2times 0 / 20 electrostatic discharge (esd) eiaj ed - 4701/300(304) c=100pf r2=1.5k 2,000v once each polarity 0 / 10 vibration, variable frequency eiaj ed - 4701/400(403) 98.1m/s2(10g) 100 2,000hz 20min xyz direction each direction 0 / 10 1. reliability testing result 2. failure criteria item symbol condition failure criteria luminous intensity i v i f =10ma testing min. value standard min. value 0.5 forward voltage v f i f =10ma testing max. value R standard max. value 1.2 reserve current i r v r =5v testing max. value R standard max. value 2.5 cosmetic appearance - - notable discoloration, deformation and cracking reference test page : 22 2016.3.17
vceg1104ls - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 23 2016.3.17

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